Description

Introducing the AES-H610E1, an IoT Edge Embedded System equipped with Intel® 12th Gen Core™ Processors with H610 Chipset. This powerful system supports up to 64GB of DDR4 SO-DIMM memory (32GB per DIMM) and features 1 x PCIe x16 (PCIe Gen4), 1 x M.2 Key B, 1 x M.2 Key E, and 2 x Mini PCIe for versatile expansion options.

With 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, and 8 x DO, the AES-H610E1 provides abundant connectivity and flexibility for various applications. The system also features 4 x Intel 2.5G LAN (2 support PoE) and 1 x Displayport, 1 x HDMI 2.0b, and 1 x VGA for multimedia needs.

The AES-H610E1 is designed with powerful Edge AI acceleration in mind, enabled by its flexible mechanical, thermal, and power design. It supports a maximum size of 275mm x 124mm x 60mm (L x H x D) and up to a 180W graphics card, making it ideal for various edge computing and AI applications.

Experience the power and flexibility of the AES-H610E1 for your next IoT project.

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 Features

● Intel® 12th Gen Core™ Processors with H610 Chipset
● 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
● 1 x PCIe x16 (PCIe Gen4)
● 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
● 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x C OM,
4 x SA TA3, 8 x DI, 8 x DO
● 4 x Intel 2.5G LAN (2 support PoE)
● 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
● Powerful Edge AI acceleration enabled by the most flexible mechanical,
thermal, and power design, with support for 275mm x 124 mm x 60 mm
(L x H x D) max.and up to 180W graphic cardn

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 System
 CPU  Intel® 12th Gen Core™, Pentium or Celeron Processors
 Chipset  Intel® H610
 Memory  LGA 1700
 Memory
 Technology  Dual Channel DDR4 2933MHz
 Capacity  64 GB (32 GB per DIMM)
 Socket  2 x 260-pin SO-DIMM
 Graphics
 Storage  Intel® UHD Graphics
 DisplayPort  DisplayPort 1.4a , DP++
 Max resolution up to 4096x2160@60Hz
 HDMI  HDMI 2.0b
 Max resolution up to 4096x2160@60Hz
 VGA  Max resolution up to 1920x1200@60Hz
 Expansion Slot
 PCIe  1 x PCIe Gen4 x16*, PCIe x16 slot with default power
 cable can support up to 180W graphic card
 (275mm x 111.15 mm x 60 mm (L x H x D), if ermove
 the card holder, it can be limited on 275mm x 124mm
 x 60 mm)Graphic card can be up to 255W with
 optional VGA module
 Mini-PCIe  1 x Full/Half size with PCIe Gen3 x1 and USB 2.0
 1 x Full/Half size with PCIe Gen3 x1
 RF& Antenna  8 x SMA connector hole reserved
 M.2  1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1
 and USB2.0 for Wi-Fi/BT module
 1 x M.2 (Key B, 2280/3042/3052) with PCIe Gen3 x1 /
 USB2.0 for 4G / 5G
 SIM Socket  2 x Nano SIM Card slot
 (1 connected to Mini PCIe, 1 connected to M.2 Key B)
 Audio
 Interface  2Realtek ALC897, High Definition Audio.
 Ethernet
 Controller/ Speed  4 x Intel 2.5G LAN(2 support PoE, PoE output max.
 15.4W/port,each port supports IEEE 802.3AF PoE)
 Connector  4 x RJ45
 Storage
 SATA  4 x SATA3 (6Gb/s)
 4 x 2.5" HDD/SSD Tray
 CFast (Option)  1 x Type II socket (Shared with SATA3)
 Rear I/O
 DisplayPort  1
 HDMI  1 
 VGA  1
 Ethernet  4 x 2.5G LAN
 USB  2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0,
 1 x USB2.0 internal connector w/ lock function
 Audio  1 x Mic-in, 1 x Line-out
 COM  4 x RS232/422/485
 2 x RS232
 DIO  8DIs/8DOs
 Watchdog Timer
 Output  From Super I/O to drag RESETCON#
 Interval  256 Segments, 0, 1, 2, ...255sec
 Power Requirements
 Input PWR  V~36V VDC
 Environment
 Operating Temp.  35W CPU: -40°C~75°C ( -40°F~167°F)
 46W~65W CPU: -40°C~55°C ( -40°F~131°F)
 (with FAN inside, without Add-on Card)
 (w/ air flow 0.5~0.8 m/s)
 Storage Temp.  -40°C~85°C ( -40°F~185°F)
 Humidity  ~95% @ 40°C (non-condensing)
 Shock  Operating: 50 G, half sine 11ms duration with SSD
 Vibration  Operating: 5 Grms, 5-500 Hz, 3 axes with SSD
 ESD  Contact +/-4kV, Air +/-8kV
 EMC  EN61000-6-4/-2, CE & FCC Class A
 Safety  LVD
 Mechanical
 Construction  Aluminum heatsink + Metal chassis
 Mounting  Desk Mount
 Dimensions  202mm (W) x 290mm (D) x 209.3mm (H)
 (7.95" x 11.42" x 8.24")
 Net Weight  10kg
 Others
 OS Support  Windows 10 & Linux
 TPM  TPM 2.0
 Real-Time
 Enablement
 TSN, TCC support under YOCTO
 CPU List
 CPU  "P-Core Basic GHz" "E-Core Basic GHz" Core Thread TDP (W)
 i9-12900TE  1.10GHz  1.00GHz  16  24  35
 i9-12900E  2.30GHz  1.70GHz  16  24  65
 i7-12700TE  1.40GHz  1.00GHz  12  20  35
 i7-12700E  2.10GHz  1.60GHz  12  20  65
 i5-12500TE  1.9GHz  N/A  6  12  35
 i5-12500E  2.9GHz  N/A  6  12  65
 i3-12100TE  2.10GHz  N/A  4  8  35
 i3-12100E  3.2GHz  N/A  4  8  65
 G6900TE  2.40GHz  N/A  2  2  35
 G6900E  3.00GHz  N/A  2  2  46

 Specifications are subject to change without notice.

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