エッジコンピューティングシステム
IES-4430
IES-4430-2
IES-4430-3
IES-4430-4
IES-4430-5
IES-4430
IES-4430-2
IES-4430-3
IES-4430-4
IES-4430-5

IES-4430

Fanless Embedded Edge System with 13th Gen Intel® Core™ i3/i5/i7 Processor

• 13th Gen Intel® Core™ i3/i5/i7
• Onboard Max LPDDR5 32 GB
• 12 ~ 24 VDC Single Power
• TPM 2.0
• Support isolated CAN, DI, DO, RS485
• Optional 4G LTE, 5G, Wi-Fi
• Fanless design
  • TPM 2.0
  • DDR5
  • CAN BUS
  • FANLESS
ダウンロードする
製品仕様
System
CPU 13th Gen Intel® Core™ i7-1365UE, i5-1335UE, i3-1315UE
Memory Onboard LPDDR5 16 GB (up to 32 GB)
Storage 1 x 2.5” Internal HDD Bay
1 x M-Key 2280, NVMe SSD
Real time clock Yes
Security TPM 2.0
Thermal Design Fanless design
Operating System Linux Kernel 5.15 LTS & above (64-bit)
Windows 10, 11 (64-bit)
Power Requirement
Input Voltage 12 ~ 24 VDC
Power Consumption TBD
Power Connector 3 pin terminal block
Environmental and Mechanical
Dimension 175 x 120 x 82 mm (6.89” x 4.72” x 3.29”)
Weight 1.5 kg
Operating Temperature 0 ~ 60 °C (32 ~ 140 °F)
Storage Temperature -40 ~ 80 °C (-40 ~ 176 °F)
Operating Humidity 5% ~ 95% relative humidity (RH), non-condensing
Certification
Regulations CE, FCC, RoHs
Interface
Serial Port 2 x Isolated RS-485 Terminal Block
2 x RS232/422/485 DB9
CAN Bus 2 x Isolated CAN Bus, Terminal Block
Ethernet 1 x RJ45 Intel® I226IT 2.5GbE LAN
1 x RJ45 Intel® I219LM GbE LAN
1 x RJ45 Intel® I210IT GbE LAN
USB 4 x USB 3.2 Gen2 (Type A)(1 x Optional)
1 x USB 2.0 (Type A)
1 x USB 4 Gen4 (Type C)
DI/DO 4 x DI, 4 x DO Isolated (Optional)
Display 1 x HDMI
1 x DP
Indicator 1 x Power Green LED
1 x Power Red LED (ATX)
Expansion Slot 1 x M.2 M-Key 2280, PCIe x4 for NVMe SSD
1 x M.2 B-Key 3042/3052, PCIe x1 + USB 3.2/2.0
1 x M.2 E-Key 2230, PCIe x1 + USB 2.0
SIM Slot 1 x Nano SIM Card Socket
Antenna 6 x External Antenna holes
外形寸法

2万人以上の業界専門家が参加。エッジAIの最新動向を受け取る。

毎月のインサイトと最新情報をお届けします。不要なメールは送りません。必要な情報だけをお届けします。

プロジェクトのご相談はありますか?

コンセプト設計から導入まで、技術パートナーとして実現を支援します

Contact us
Language